Research

Code H192 Grant Type TIER 1
Date Start 01-07-2018 Date End 30-06-2020
Extension 31-12-2020 Period 6
Title Failure Analysis Study Of Microelectronics Packaging Using Cad Software
Research Type Applied
Area F3010000 - Engineering and Technology
MRDC Group Electrical and Electronic Engineering
MRDC Area Microelectronics
SEO Group
SEO Area
Amount RM 20,000.00
Researchers
AHMAD ALABQARI BIN MA'RADZI
MUHAMMAD MAHADI BIN ABDUL JAMIL
TENGKU NADZLIN BIN TENGKU IBRAHIM
MOHD HELMY BIN ABD WAHAB
MUHAMMAD SHUKRI BIN AHMAD
HASLIZA BINTI HASSAN
RADZI BIN AMBAR

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